Clas-SiC enables customers to make the leap from lab to fab, to low/medium production volumes through fast development and prototyping of new SiC devices. 

---

Clas-SiC Solutions 

We support customers all the way through development, seeding samples, up to medium volume production, after which we would actively facilitate transfer to a high volume foundry partner. 

Reliability proven SiC Process Design Kits (PDK’s) are available for planar MOSFETs and JBS/MPS diodes.

Clas-SiC offers not only device processing but also process module solutions as well as individual process capabilities. 

Process Design Kits Released

1200V MOSFET Process Design Kit – reliability proven

1700V MOSFET Process Design Kit – reliability proven

3300V MOSFET Process Design Kit – reliability proven

JBS/MPS Diode Design Kit – reliability proven

Process Modules

Alignment target

Implant hard mask

Carbon cap implant anneal

MOSFET gate dielectric and gate polysilicon

Backside ohmic contact

Frontside n+ and p+ ohmic contacts

Schottky contact

MOSFET gate and source contacts

Power metal

Passivation

Backside tri-metal

Wafer test

Prototype reliability of packaged parts

Thinned wafer backside ohmic contact