Clas-SiC enables customers to make the leap from lab to fab, to low/medium production volumes through fast development and prototyping of new SiC devices. 

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Clas-SiC Solutions 

We support customers all the way through development, seeding samples, up to medium volume production, after which we would actively facilitate transfer to a high volume foundry partner. 

Reliability proven SiC Process Design Kits (PDK’s) are available for planar MOSFETs and JBS/MPS diodes.

Clas-SiC offers not only device processing but also process module solutions as well as individual process capabilities. Our Lochgelly facility achieved the NMI Manufacturing Site of the Year Award in December 2022.

Process Design Kits Released

1200V MOSFET Process Design Kit – reliability proven

1700V MOSFET Process Design Kit – reliability proven

3300V MOSFET Process Design Kit – reliability proven

JBS/MPS Diode Design Kit – reliability proven

Process Modules

Alignment target

Implant hard mask

Carbon cap implant anneal

MOSFET gate dielectric and gate polysilicon

Backside ohmic contact

Frontside n+ and p+ ohmic contacts

Schottky contact

MOSFET gate and source contacts

Power metal

Passivation

Backside tri-metal

Wafer test

Prototype reliability of packaged parts

Thinned wafer backside ohmic contact